Toray Engineering: Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels
High-accuracy packaging in panel level packaging TOKYO, JAPAN – Media OutReach Newswire – 27 March 2025 – Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging “PLP”. PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers. Sales of the […]
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